COMPRION Presents New LPA Simulation at Mobile World Congress 2017
Verfasser: comprion on Tuesday, 28 February 2017Indispensable software solution to prepare eUICC consumer devices for market launch
At Mobile World Congress 2017, taking place from February 27 to March 02 in Barcelona, COMPRION will present its new LPA Simulation, which is a new add-on for the interoperability testing solution COMPRION Network Bridge. It helps eUICC manufacturers and SM-DP+ back-end server developers to easily implement end-to end test scenarios within the consumer device environment. “It significantly reduces testing complexity,” explains Jens Christoph, Director for eUICC Test Solutions at COMPRION. “Development engineers want to prove that their developed eUICC and SM-DP+ server work as intended and that these two components communicate correctly with each other. For connecting these two components, the engineers can substitute the real smartphone and LPA with our mobile equipment simulation and LPA Simulation.”